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HA9P5320-5ZX96 - Renesas Electronics

Description: The HA-5320 was designed for use in precision, High-Speed data acquisition systems. The circuit consists of an input transconductance amplifier capable of providing large amounts of charging current, a low leakage analog switch, and an output integrating amplifier. The analog switch sees virtual ground as its load; therefore, charge injection on the hold capacitor is constant over the entire input/output voltage range. The pedestal voltage resulting from this charge injection can be adjusted to zero by use

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HA9P5320-5ZX96 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.3 (JEDEC MS-013-AA ISSUE C)
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HA9P5320-5ZX96 - Renesas Electronics  - 3D model - Small Outline Packages - M16.3 (JEDEC MS-013-AA ISSUE C)
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HA9P5320-5ZX96 Details

  • Manufacturer Part Number:

    HA9P5320-5ZX96

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.3

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • Acquisition Time-Max:

    1.5 µs

  • Acquisition Time-Nom:

    1 µs

  • Amplifier Type:

    SAMPLE AND HOLD CIRCUIT

  • Analog Input Voltage-Max:

    -10 V

  • Analog Input Voltage-Min:

    10 V

  • Droop Rate-Max:

    100 V/s

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    13 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

HA9P5320-5ZX96 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal protection circuits and over-temperature protection.
  • Critical timing parameters include clock frequency, clock skew, and setup/hold times. Ensure timing closure by using a timing analyzer tool, and by following the recommended PCB layout and routing guidelines.
  • Power sequencing should be handled according to the recommended power-up sequence in the datasheet. A power-on reset circuit can be implemented using an external reset IC or a simple RC circuit.
  • Use ESD protection devices such as TVS diodes or ESD arrays on all input/output pins. Implement latch-up prevention measures such as using a latch-up immune process, and following the recommended PCB layout guidelines.

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HA9P5320-5ZX96 Overview

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