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HBS410-13 - Diodes Incorporated

Description: Bridge Rectifiers Medium/High Power Bridge HBS T&R 2.5K

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HBS410-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
HBS410-13 - Diodes Incorporated PCB footprint - Other - Other - HBS410-13-2
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3D Models
HBS410-13 - Diodes Incorporated - 3D model - Other - HBS410-13-2
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HBS410-13 Details

  • Manufacturer Part Number:

    HBS410-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2020-04-22

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Breakdown Voltage-Min:

    1000 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.98 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

HBS410-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the HBS410-13 should minimize parasitic inductance and capacitance. Place the device close to the power source, use short and wide traces, and avoid vias under the device. A 4-layer PCB with a solid ground plane is recommended.
  • Proper thermal management is crucial for the HBS410-13. Ensure good thermal contact between the device and the PCB, use thermal vias, and consider adding a heat sink or thermal pad. Keep the device away from heat sources and ensure good airflow.
  • Although the datasheet doesn't specify a maximum voltage for the EN pin, it's recommended to keep it within the VCC range (typically 5V or 3.3V) to ensure proper operation and prevent damage.
  • The HBS410-13 is rated for operation up to 125°C, but its performance may degrade at higher temperatures. Consider derating the device or using a heat sink to maintain a safe operating temperature.
  • To troubleshoot issues with the HBS410-13, check the power supply voltage, ensure proper PCB layout and thermal management, verify the enable pin (EN) signal, and inspect for signs of physical damage or overheating.

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HBS410-13 Overview

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