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HC55185GIMZ - Renesas Electronics

Description: The RSLIC-VoIP family of Ringing Subscriber Line Interface Circuits (RSLIC) supports analog Plain Old Telephone Service (POTS) in short and medium loop length, wireless and wireline applications. Ideally suited for remote subscriber units, this family of products offers flexibility to designers with high ringing voltage and low power consumption system requirements. The RSLIC-VoIP family operates to 100V which translates directly to the amount of ringing voltage supplied to the end subscriber. With the high

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HC55185GIMZ - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - N28.45
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HC55185GIMZ Details

  • Manufacturer Part Number:

    HC55185GIMZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PLCC

  • Pin Count:

    28

  • Manufacturer Package Code:

    N28.45

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    245

  • Telecom IC Type:

    SLIC

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

HC55185GIMZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes recommendations for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • The HC55185GIMZ has a built-in overcurrent protection feature, but it requires external components to implement. Renesas provides a reference design and calculation guidelines in their datasheet and application notes to help engineers design an overcurrent protection circuit.
  • The recommended input capacitor value and type depend on the specific application and operating conditions. Renesas provides general guidelines in their datasheet, but engineers should consult with their local Renesas support team or refer to the application notes for more specific recommendations.
  • Renesas provides a troubleshooting guide in their application notes, which covers common issues and their possible causes. Engineers can also consult with Renesas' technical support team for further assistance.
  • Renesas provides thermal design guidelines and recommendations for high-temperature environments in their application notes. Engineers should consider factors such as thermal resistance, junction temperature, and airflow when designing their system.

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HC55185GIMZ Overview

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