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HCC4030BDT - STMicroelectronics

Description: INTEGRATED CIRCUITS, SILICON MONOLITHIC, CMOS QUAD 2-INPUT EXCLUSIVE OR GATE WITH FULLY BUFFERED OUTPUTS

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HCC4030BDT - STMicroelectronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - DIL14 FP_2023
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HCC4030BDT Details

  • Manufacturer Part Number:

    HCC4030BDT

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIL-14

  • Manufacturer Package Code:

    DIL14 FP

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    4.5

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-GDIP-T14

  • Length:

    19 mm

  • Logic IC Type:

    XOR GATE

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TR

  • Schmitt Trigger:

    NO

  • Screening Level:

    EUROPEAN SPACE AGENCY

  • Seated Height-Max:

    3.7 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Total Dose:

    100k Rad(Si) V

  • Width:

    7.62 mm

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HCC4030BDT Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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