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HCC4555BDG - STMicroelectronics

Description: Rad-hard, high voltage, CMOS4000B logic series

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HCC4555BDG - STMicroelectronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - DIL16-1
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HCC4555BDG Details

  • Manufacturer Part Number:

    HCC4555BDG

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIL-16

  • Manufacturer Package Code:

    DIL16 FP

  • Country Of Origin:

    France

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5

  • Family:

    4000/14000/40000

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-GDIP-T16

  • Length:

    20.32 mm

  • Logic IC Type:

    2-LINE TO 4-LINE DECODER

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Screening Level:

    ESCC9000

  • Seated Height-Max:

    3.83 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Total Dose:

    100k Rad(Si) V

  • Width:

    7.62 mm

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HCC4555BDG Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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