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HCF4069UBEY - STMicroelectronics

Description: STMicroelectronics HCF4069UBEY, Hex, Buffered Inverter, 3 → 20 V, 14-Pin PDIP

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HCF4069UBEY - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - HCF4069UBEY
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HCF4069UBEY Details

  • Manufacturer Part Number:

    HCF4069UBEY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-14

  • Pin Count:

    14

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-PDIP-T14

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    INVERTER

  • Number of Functions:

    6

  • Number of Inputs:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP14,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Prop. Delay@Nom-Sup:

    110 ns

  • Propagation Delay (tpd):

    110 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    5.1 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

HCF4069UBEY Frequently Asked Questions (FAQs)

  • The maximum frequency of operation for the HCF4069UBEY is typically around 10 MHz, but it can vary depending on the specific application and operating conditions.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking and ensuring good airflow around the device. Additionally, consider using a thermally-enhanced package or a device with a higher temperature rating.
  • The recommended power-on sequence for the HCF4069UBEY is to apply the power supply voltage (VCC) before applying any input signals. This helps prevent unwanted latch-up or oscillations during power-up.
  • To minimize EMI and EMC issues, use proper PCB layout techniques, such as separating analog and digital circuits, using ground planes, and adding decoupling capacitors. Additionally, consider using EMI filters or shielding to reduce electromagnetic radiation.
  • When laying out and routing the PCB, ensure that the HCF4069UBEY is placed in a quiet area of the board, away from noise sources and high-current paths. Use short, direct traces for power and ground connections, and avoid running signal traces near the device's power pins.

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HCF4069UBEY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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