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HCTSM80102AAL-E - Bourns

Description: 250µH Isolation and Data Interface (Encapsulated) Pulse Transformer 1:2 Surface Mount

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PCB Footprints
HCTSM80102AAL-E - Bourns PCB footprint - Other - Other - HCTSM80102AAL-E-2
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3D Models
HCTSM80102AAL-E - Bourns  - 3D model - Other - HCTSM80102AAL-E-2
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HCTSM80102AAL-E Details

  • Manufacturer Part Number:

    HCTSM80102AAL-E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.9

  • Application:

    ISOLATION

  • Approvals:

    AEC-Q200; CUL; IEC; UL

  • ET Product-Min:

    11 V-us

  • Height:

    6.5 mm

  • Isolation Voltage:

    5000 V

  • Length:

    12.3 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    TR, 13 INCH

  • Primary Inductance:

    250 µH

  • Surface Mount:

    YES

  • Transformer Type:

    PULSE TRANSFORMER

  • Turns Ratio (Np:Ns):

    1:2

  • Width:

    10.8 mm

HCTSM80102AAL-E Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize parasitic inductance and capacitance. A 4-layer PCB with a dedicated ground plane is also recommended.
  • To ensure reliability in high-temperature applications, it is recommended to derate the current rating of the device according to the temperature derating curve provided in the datasheet. Additionally, ensure proper thermal management, such as using a heat sink or thermal interface material, to keep the device temperature within the recommended operating range.
  • Bourns recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds, and a minimum temperature of 217°C (423°F) for a minimum of 90 seconds. The total thermal exposure should not exceed 30 seconds.
  • Yes, HCTSM80102AAL-E is designed to withstand high-vibration environments. However, it is recommended to follow proper mounting and soldering techniques to ensure the device is securely attached to the PCB. Additionally, consider using a vibration-dampening material or potting compound to further reduce the effects of vibration.
  • To troubleshoot issues with HCTSM80102AAL-E, start by checking the device's operating conditions, such as input voltage, current, and temperature. Verify that the device is properly soldered and mounted to the PCB. Check for any signs of physical damage or contamination. If the issue persists, consult the datasheet and application notes, or contact Bourns' technical support for further assistance.

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HCTSM80102AAL-E Overview

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