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HD6417320BP133CV - Renesas Electronics

Description: The SH7720 microprocessor incorporates the 32-bit SH3-DSP CPU and is also equipped with peripheral functions necessary for configuring a user's system and realizes low power consumption. The SH7720 is built in with a variety of peripheral functions such as color LCD controller, SSL (Secure Socket Layer) hardware accelerator, version 1.1 USB interface (host and function) and many kind of interfaces. The SH7720 can realize faster secure network connectivity and makes it suitable for variety kinds of IT and mo

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HD6417320BP133CV - Renesas Electronics PCB footprint - BGA - BGA - P-LFBGA256-17x17-0.80_1
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HD6417320BP133CV - Renesas Electronics  - 3D model - BGA - P-LFBGA256-17x17-0.80_1
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HD6417320BP133CV Details

  • Manufacturer Part Number:

    HD6417320BP133CV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LFBGA

  • Package Description:

    CSP-256

  • Pin Count:

    256

  • Manufacturer Package Code:

    PLBG0256GA

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES WITH 3.3 V NOMINAL SUPPLY

  • Address Bus Width:

    26

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    SH7000

  • Clock Frequency-Max:

    48 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    17 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    6

  • Number of External Interrupts:

    7

  • Number of I/O Lines:

    117

  • Number of Terminals:

    256

  • Number of Timers:

    7

  • On Chip Data RAM Width:

    8

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    16384

  • Seated Height-Max:

    1.4 mm

  • Speed:

    133.34 MHz

  • Supply Current-Max:

    300 mA

  • Supply Voltage-Max:

    1.6 V

  • Supply Voltage-Min:

    1.4 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

HD6417320BP133CV Overview

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