HD74HC1G08CME-E - Renesas Electronics

HD74HC1G08CME-E Details

• Manufacturer Part Number:

  HD74HC1G08CME-E

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Part Package Code:

  SOIC

• Package Description:

  CMPAK-5

• Pin Count:

  5

• HTS Code:

  8542.39.00.60

• Manufacturer:

  Renesas Electronics Corporation

• Family:

  HC/UH

• JESD-30 Code:

  R-PDSO-G5

• JESD-609 Code:

  e6

• Length:

  2 mm

• Load Capacitance (CL):

  50 pF

• Logic IC Type:

  AND GATE

• Max I(ol):

  0.002 A

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Inputs:

  2

• Number of Terminals:

  5

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP5/6,.08

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Packing Method:

  TR

• Prop. Delay@Nom-Sup:

  25 ns

• Propagation Delay (tpd):

  125 ns

• Qualification Status:

  Not Qualified

• Schmitt Trigger:

  NO

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max (Vsup):

  6 V

• Supply Voltage-Min (Vsup):

  2 V

• Supply Voltage-Nom (Vsup):

  4.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN BISMUTH

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Width:

  1.25 mm