HDE102MBDDF0KR footprint, schematic symbol and 3D model by Vishay

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PCB Footprints

HDE102MBDDF0KR - Vishay PCB footprint - Other - Other - HDE102MBDDF0KR-3

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Part Number HDE102MBDDF0KR
Manufacturer Vishay
Pin Count 2
Part Category Capacitor
Package Category Other
Footprint Name Other - HDE102MBDDF0KR-3
Released Date Jul 17, 2025
Last Modified Date Jul 17, 2025 6:45 PM UTC
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HDE102MBDDF0KR Details

Manufacturer Part Number:
HDE102MBDDF0KR
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
RADIAL LEADED, ROHS COMPLIANT
Reach Compliance Code:
Compliant
ECCN Code:
EAR99
HTS Code:
8532.23.00.60
Factory Lead Time:
7 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
7
Capacitance:
0.001 µF
Capacitor Type:
CERAMIC CAPACITOR
Dielectric Material:
CERAMIC
JESD-609 Code:
e3
Mounting Feature:
THROUGH HOLE MOUNT
Multilayer:
No
Negative Tolerance:
20%
Number of Terminals:
2
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Shape:
DISK PACKAGE
Positive Tolerance:
20%
Rated (DC) Voltage (URdc):
4000 V
Surface Mount:
NO
Terminal Finish:
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape:
WIRE

HDE102MBDDF0KR Frequently Asked Questions (FAQs)

The recommended PCB footprint for the HDE102MBDDF0KR is a rectangular pad with dimensions of 2.5mm x 1.7mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB, use a thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device.
The maximum operating temperature range for the HDE102MBDDF0KR is -55°C to 150°C, with a storage temperature range of -55°C to 180°C.
Yes, the HDE102MBDDF0KR is suitable for high-reliability applications, as it is built with a robust design and has undergone rigorous testing to ensure its reliability and performance.
To ensure proper soldering, follow the recommended soldering profile, use a solder with a melting point above 217°C, and avoid applying excessive force or pressure during the soldering process.

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HDE102MBDDF0KR Overview

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