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HE3621A1200 - LITTELFUSE

Description: Reed Relays REED RELAY

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HE3621A1200 - LITTELFUSE PCB footprint - Other - Other - HE3621A1200-1
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HE3621A1200 - LITTELFUSE  - 3D model - Other - HE3621A1200-1
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HE3621A1200 Details

  • Manufacturer Part Number:

    HE3621A1200

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Body Breadth:

    5.65 mm

  • Body Height:

    7.87 mm

  • Body Length or Diameter:

    19.7 mm

  • Coil Current(DC)-Max:

    0.012 A

  • Coil Operate Voltage(DC):

    8 V

  • Coil Power:

    144 mW

  • Coil Release Voltage(DC):

    1 V

  • Coil Resistance:

    1000 Ω

  • Coil Voltage(DC)-Max:

    22 V

  • Coil Voltage-Nom:

    12 V

  • Coil/Input Supply Type:

    DC

  • Contact Current(DC)-Max:

    0.5 A

  • Contact (DC) Max Rating R Load:

    0.5A@200VDC

  • Contact Resistance:

    150 mΩ

  • Contact Voltage(DC)-Max:

    200 V

  • Contact/Output Supply Type:

    DC

  • Input Switching Control Type:

    Random

  • Insulation Resistance:

    10000000000 Ω

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Number of Terminals:

    4

  • Operate Time:

    1 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Physical Dimension:

    19.7mm x 5.65mm x 7.87mm

  • Reference Standard:

    CUL; UL

  • Relay Action:

    MOMENTARY

  • Relay Form:

    1 FORM A

  • Relay Function:

    SPST

  • Relay Type:

    DRY REED RELAY

  • Release Time:

    1 ms

  • Sealing:

    HERMETICALLY SEALED

  • Surface Mount:

    NO

  • Terminal Length:

    0.002999745999491999 inch

  • Termination Type:

    SOLDER

HE3621A1200 Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a 2-layer PCB design with a solid ground plane on the bottom layer. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device. A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure proper soldering, follow the recommended reflow profile and use a solder paste with a melting point between 217°C to 220°C. Avoid exposing the device to temperatures above 240°C. Use a soldering iron with a temperature-controlled tip and avoid applying excessive force, which can damage the device.
  • Handle the device by the body or pins, avoiding direct contact with the die. Store the device in an anti-static bag or wrap it in anti-static material. Ensure the workspace and tools are ESD-protected. Ground yourself using an ESD strap or mat before handling the device.
  • While the HE3621A1200 is a high-quality device, it's essential to consult with Littelfuse Inc or a qualified representative to determine its suitability for high-reliability or aerospace applications. Additional testing, screening, and certification may be required to meet specific industry standards.
  • Start by verifying the device is properly soldered and the PCB layout is correct. Check the input and output voltages, and ensure the device is operated within the recommended specifications. Use a scope or multimeter to measure voltage and current waveforms. Consult the datasheet and application notes for troubleshooting guidelines.

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HE3621A1200 Overview

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