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HE722A0500 - LITTELFUSE

Description: Reed Relay, He700 Series, 5 Vdc, 200 Ohm, 500 Ma, 200 Vdc, Dpst-No

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PCB Footprints
HE722A0500 - LITTELFUSE PCB footprint - Other - Other - HE722A0500-2
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3D Models
HE722A0500 - LITTELFUSE  - 3D model - Other - HE722A0500-2
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HE722A0500 Details

  • Manufacturer Part Number:

    HE722A0500

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Body Breadth:

    7.22 mm

  • Body Height:

    5.5 mm

  • Body Length or Diameter:

    19.05 mm

  • Coil Current(DC)-Max:

    0.025 A

  • Coil Operate Voltage(DC):

    3.75 V

  • Coil Power:

    125 mW

  • Coil Release Voltage(DC):

    0.5 V

  • Coil Resistance:

    200 Ω

  • Coil Voltage(DC)-Max:

    12 V

  • Coil Voltage-Nom:

    5 V

  • Coil/Input Supply Type:

    DC

  • Contact (AC) Max Rating R Load:

    0.35A@140VAC

  • Contact Current(AC)-Max:

    0.35 A

  • Contact Current(DC)-Max:

    0.5 A

  • Contact (DC) Max Power Rating R Load:

    10W@200VDC

  • Contact (DC) Max Rating R Load:

    0.5A@200VDC

  • Contact Resistance:

    150 mΩ

  • Contact Voltage(AC)-Max:

    140 V

  • Contact Voltage(DC)-Max:

    200 V

  • Contact/Output Supply Type:

    AC/DC

  • Input Switching Control Type:

    Random

  • Insulation Resistance:

    10000000000 Ω

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Number of Terminals:

    8

  • Operate Time:

    1 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BULK

  • Reference Standard:

    CUL; UL

  • Relay Action:

    MOMENTARY

  • Relay Form:

    2 FORM A

  • Relay Function:

    DPST

  • Relay Type:

    DRY REED RELAY

  • Release Time:

    1 ms

  • Sealing:

    HERMETICALLY SEALED

  • Surface Mount:

    NO

  • Terminal Length:

    0.002999745999491999 inch

  • Termination Type:

    SOLDER

HE722A0500 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the HE722A0500 is a rectangular pad with a minimum size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • Yes, the HE722A0500 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes thermal stress on the device.
  • Store the HE722A0500 in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or pads to prevent damage or contamination.
  • Yes, the HE722A0500 is designed to withstand moderate vibration and shock. However, it's essential to follow proper mounting and soldering techniques to ensure the device remains securely attached to the PCB.

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HE722A0500 Overview

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