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HE722A0510 - LITTELFUSE

Description: Reed Relay 5VDC 200Ohm 0.5A DPST-NO(19.5x9.52x5.5)mm THT Dry

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PCB Footprints
HE722A0510 - LITTELFUSE PCB footprint - Other - Other - HE722A0510-3
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HE722A0510 - LITTELFUSE  - 3D model - Other - HE722A0510-3
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HE722A0510 Details

  • Manufacturer Part Number:

    HE722A0510

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Additional Feature:

    COIL SUPPRESSION DIODE

  • Body Breadth:

    7.22 mm

  • Body Height:

    5.5 mm

  • Body Length or Diameter:

    19.05 mm

  • Coil Current(DC)-Max:

    0.025 A

  • Coil Operate Voltage(DC):

    3.75 V

  • Coil Power:

    125 mW

  • Coil Release Voltage(DC):

    0.5 V

  • Coil Resistance:

    200 Ω

  • Coil Voltage(DC)-Max:

    12 V

  • Coil Voltage-Nom:

    5 V

  • Coil/Input Supply Type:

    DC

  • Contact Current(DC)-Max:

    0.5 A

  • Contact (DC) Max Power Rating R Load:

    10W@200VDC

  • Contact (DC) Max Rating R Load:

    0.5A@200VDC

  • Contact Resistance:

    150 mΩ

  • Contact Voltage(DC)-Max:

    200 V

  • Contact/Output Supply Type:

    DC

  • Input Switching Control Type:

    Random

  • Insulation Resistance:

    10000000000 Ω

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Number of Terminals:

    8

  • Operate Time:

    1 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BULK

  • Physical Dimension:

    19.05mm x 7.22mm x 5.5mm

  • Reference Standard:

    CUL; UL

  • Relay Action:

    MOMENTARY

  • Relay Form:

    2 FORM A

  • Relay Function:

    DPST

  • Relay Type:

    DRY REED RELAY

  • Release Time:

    1 ms

  • Sealing:

    HERMETICALLY SEALED

  • Surface Mount:

    NO

  • Terminal Length:

    0.002999745999491999 inch

  • Termination Type:

    SOLDER

HE722A0510 Frequently Asked Questions (FAQs)

  • Littelfuse recommends a thermal pad size of 100mm² with a 1oz copper thickness and a solder mask opening of 1.5mm to ensure optimal thermal performance. A detailed land pattern is available in the Littelfuse application note AN1005.
  • To ensure reliable soldering, Littelfuse recommends using a soldering temperature of 260°C (max) with a dwell time of 3-5 seconds. A soldering iron with a temperature control system is recommended. Additionally, a solder with a melting point of 217°C (423°F) or higher is recommended.
  • The HE722A0510 is designed to withstand voltage stresses up to 1.5 times the rated voltage for a maximum of 10 seconds. However, it is recommended to limit the voltage stress to 1.2 times the rated voltage for reliable operation.
  • The HE722A0510 is rated for operation up to 150°C. However, derating is required for temperatures above 125°C. Consult the datasheet for derating curves and guidelines for high-temperature operation.
  • Handle the HE722A0510 by the body, avoiding touching the leads or thermal pad. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and do not stack devices on top of each other.

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