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HE722A1210 - LITTELFUSE

Description: Reed Relay 12VDC 500Ohm 0.5ADC/0.35AAC DPST-NO(19.5x9.52x5.5)mm THT Dry

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PCB Footprints
HE722A1210 - LITTELFUSE PCB footprint - Other - Other - HE722A1210-4
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3D Models
HE722A1210 - LITTELFUSE  - 3D model - Other - HE722A1210-4
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HE722A1210 Details

  • Manufacturer Part Number:

    HE722A1210

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.49.00.50

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Additional Feature:

    COIL SUPPRESSION DIODE

  • Body Breadth:

    7.22 mm

  • Body Height:

    5.5 mm

  • Body Length or Diameter:

    19.05 mm

  • Coil Current(DC)-Max:

    0.024 A

  • Coil Operate Voltage(DC):

    8 V

  • Coil Power:

    288 mW

  • Coil Release Voltage(DC):

    1 V

  • Coil Resistance:

    500 Ω

  • Coil Voltage(DC)-Max:

    22 V

  • Coil Voltage-Nom:

    12 V

  • Coil/Input Supply Type:

    DC

  • Contact Current(DC)-Max:

    0.5 A

  • Contact (DC) Max Power Rating R Load:

    10W@200VDC

  • Contact (DC) Max Rating R Load:

    0.5A@200VDC

  • Contact Resistance:

    150 mΩ

  • Contact Voltage(DC)-Max:

    200 V

  • Contact/Output Supply Type:

    DC

  • Input Switching Control Type:

    Random

  • Insulation Resistance:

    10000000000 Ω

  • Mounting Feature:

    THROUGH HOLE-STRAIGHT

  • Number of Terminals:

    8

  • Operate Time:

    1 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BULK

  • Physical Dimension:

    19.05mm x 7.22mm x 5.5mm

  • Reference Standard:

    CUL; UL

  • Relay Action:

    MOMENTARY

  • Relay Form:

    2 FORM A

  • Relay Function:

    DPST

  • Relay Type:

    DRY REED RELAY

  • Release Time:

    1 ms

  • Sealing:

    HERMETICALLY SEALED

  • Surface Mount:

    NO

  • Terminal Length:

    0.002999745999491999 inch

  • Termination Type:

    SOLDER

HE722A1210 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the HE722A1210 is a rectangular pad with a size of 1.27mm x 0.5mm, with a 0.5mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for the HE722A1210 is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • Handle the HE722A1210 by the body, avoiding touching the leads or pads to prevent damage from electrostatic discharge (ESD). Use an ESD wrist strap or mat to discharge static electricity.
  • The recommended reflow soldering profile for the HE722A1210 is a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds above 217°C.

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HE722A1210 Overview

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