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HFA1100IBZ - Renesas Electronics

Description: Intersil HFA1100IBZ Current Feedback Op Amp, 8-Pin SOIC

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PCB Footprints
HFA1100IBZ - Renesas Electronics PCB footprint - Other - Other - SOIC127P600X175-8N
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HFA1100IBZ - Renesas Electronics  - 3D model - Other - SOIC127P600X175-8N
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HFA1100IBZ Details

  • Manufacturer Part Number:

    HFA1100IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    65 µA

  • Bias Current-Max (IIB) @25C:

    40 µA

  • Common-mode Reject Ratio-Min:

    38 dB

  • Common-mode Reject Ratio-Nom:

    46 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUT LINE

  • Packing Method:

    TR

  • Power:

    NO

  • Programmable Power:

    NO

  • Slew Rate-Min:

    1850 V/us

  • Slew Rate-Nom:

    2300 V/us

  • Supply Current-Max:

    33 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Wideband:

    NO

HFA1100IBZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the application note 'HFA1100IBZ PCB Layout Guidelines' (document number R01DS0244EJ0100). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
  • Renesas provides a component selection guide in the datasheet, which includes recommended values for resistors, capacitors, and inductors. Additionally, the application note 'HFA1100IBZ Design Guide' (document number R01DS0245EJ0100) provides more detailed information on component selection and layout considerations.
  • The HFA1100IBZ has an operating temperature range of -40°C to +125°C. However, it's essential to note that the device's performance and reliability may be affected at extreme temperatures. Consult the datasheet and application notes for more information on temperature-related considerations.
  • Renesas provides troubleshooting guides and application notes that address common issues with the HFA1100IBZ. For example, the application note 'HFA1100IBZ Troubleshooting Guide' (document number R01DS0246EJ0100) provides step-by-step procedures for identifying and resolving common problems. Additionally, Renesas' technical support team can provide assistance with troubleshooting and debugging.
  • Yes, the HFA1100IBZ is a high-frequency device, and EMI and EMC considerations are crucial to ensure reliable operation. Renesas provides guidelines for EMI and EMC design in the application note 'HFA1100IBZ EMI and EMC Design Guide' (document number R01DS0247EJ0100). It's essential to follow these guidelines to minimize EMI and ensure compliance with relevant EMC standards.

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