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HFA1100IP - Renesas Electronics

Description: High Speed Operational Amplifiers

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HFA1100IP - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - E8.3
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HFA1100IP - Renesas Electronics  - 3D model - Dual-In-Line Packages - E8.3
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HFA1100IP Details

  • Manufacturer Part Number:

    HFA1100IP

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    DIP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Average Bias Current-Max (IIB):

    65 µA

  • Bias Current-Max (IIB) @25C:

    40 µA

  • Common-mode Reject Ratio-Min:

    38 dB

  • Common-mode Reject Ratio-Nom:

    46 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Slew Rate-Min:

    1850 V/us

  • Slew Rate-Nom:

    2300 V/us

  • Supply Current-Max:

    33 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Wideband:

    NO

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