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HFA1105IBZ96 - Renesas Electronics

Description: The HFA1105 is a High-Speed, low power current feedback amplifier built with Intersil's proprietary complementary bipolar UHF-1 process. This amplifier features an excellent combination of low power dissipation (58mW) and high performance. The slew rate, bandwidth, and low output impedance (0. 08Ω) make this amplifier a good choice for driving Flash ADCs. Component and composite video systems also benefit from this op amp's excellent gain flatness, and good differential gain and phase specifications. The HF

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HFA1105IBZ96 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (8 LD SOIC)
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HFA1105IBZ96 - Renesas Electronics  - 3D model - Small Outline Packages - (8 LD SOIC)
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HFA1105IBZ96 Details

  • Manufacturer Part Number:

    HFA1105IBZ96

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Common-mode Reject Ratio-Min:

    47 dB

  • Common-mode Reject Ratio-Nom:

    50 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -5.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1200 V/us

  • Supply Current-Max:

    6.3 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Wideband:

    YES

  • Width:

    3.9 mm

HFA1105IBZ96 Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the HFA1105IBZ96. Ensure a solid ground plane, keep the input and output traces short and separate, and use a common mode choke to reduce EMI. Refer to the application note 'HFA1105IBZ96 PCB Layout Guidelines' for more information.
  • The HFA1105IBZ96 has a high inrush current during startup. To mitigate this, use a soft-start circuit or a current limiter to reduce the inrush current. You can also use a larger input capacitor to filter out the startup current surge.
  • The HFA1105IBZ96 can operate from -40°C to 125°C (TJ). However, the device's performance and reliability may degrade above 85°C. Ensure proper thermal management and heat sinking to maintain a safe operating temperature.
  • Start by checking the input voltage, output voltage, and current. Verify that the device is properly configured and that the input and output capacitors are correctly sized. Use an oscilloscope to check for oscillations or noise on the output. Refer to the datasheet and application notes for troubleshooting guidelines.
  • Yes, the HFA1105IBZ96 is suitable for high-reliability and automotive applications. It meets the AEC-Q100 qualification standard for automotive-grade devices. However, ensure that you follow the recommended design and manufacturing guidelines to meet the specific requirements of your application.

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