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HFA1130IBZ - Renesas Electronics

Description: The HFA1130 is a High-Speed wideband current feedback amplifier featuring programmable output limits. Built with Intersil’s proprietary complementary bipolar UHF-1 process, it is the fastest monolithic amplifier available from any semiconductor manufacturer. This amplifier is the ideal choice for high frequency applications requiring output limiting, especially those needing ultra fast overdrive recovery times. The output limiting function allows the designer to set the maximum positive and negative output

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HFA1130IBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15-ren4
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HFA1130IBZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.15-ren4
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HFA1130IBZ Details

  • Manufacturer Part Number:

    HFA1130IBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOICN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Bias Current-Max (IIB) @25C:

    50 µA

  • Common-mode Reject Ratio-Min:

    38 dB

  • Common-mode Reject Ratio-Nom:

    46 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1850 V/us

  • Slew Rate-Nom:

    1400 V/us

  • Supply Current-Max:

    33 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Wideband:

    YES

  • Width:

    3.9 mm

HFA1130IBZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients and hotspots.
  • Critical timing parameters include clock frequency, setup and hold times, and propagation delay. Ensure that these parameters are met by following the recommended clocking scheme and signal routing guidelines.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input/output pins, and follow proper PCB design and handling practices to prevent ESD damage.
  • The device requires a specific power-on sequence to ensure proper operation. The recommended power-on sequence is VCC, then VDD, and finally the clock signal.

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