TDK recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2-layer PCB is recommended, with the component mounted on the top layer and the ground plane on the bottom layer.
The HHM1749H1 has a high power density, so thermal management is crucial. TDK recommends using a heat sink or a thermal pad to dissipate heat. The component's thermal pad should be connected to a solid ground plane to ensure efficient heat dissipation.
TDK recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 30 seconds. The component is sensitive to thermal shock, so a gradual temperature increase and decrease is recommended.
To ensure reliability in high-vibration environments, TDK recommends using a secure mounting method, such as screwing or adhesive bonding, to prevent the component from detaching from the PCB. Additionally, a conformal coating can be applied to protect the component from environmental factors.
The HHM1749H1 is designed for high-frequency operation, but its behavior may vary depending on the specific application. TDK recommends consulting the component's S-parameters and impedance characteristics to ensure optimal performance in high-frequency applications.
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HHM1749H1 Overview
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About TDK
TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.
