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HI1-0201/883 - Renesas Electronics

Description: The HI-201/883 is a monolithic device comprised of four independently selectable SPST switchers which feature fast switching speeds (185ns typical) combined with low power dissipation (15mW typical at +25°C). Each switch provides low ON resistance operation for input signal voltages up to the supply rails and for signal currents up to 25mA continuous. Rugged DI construction eliminates latchup and substrate SCR failure modes. All devices provide break-before-make switching and are TTL and CMOS compatible for

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HI1-0201/883 - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - F16.3 cerdip
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HI1-0201/883 - Renesas Electronics  - 3D model - Ceramic Dual-In-Line Packages - F16.3 cerdip
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HI1-0201/883 Details

  • Manufacturer Part Number:

    HI1-0201/883

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CERDIP

  • Package Description:

    DIP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    F16.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2018-07-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Additional Feature:

    LG-MAX

  • Analog IC - Other Type:

    SPST

  • Input Voltage-Max:

    17 V

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    21.34 mm

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NC

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • On-state Resistance-Max (Ron):

    70 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Signal Current-Max:

    0.025 A

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    800 ns

  • Switch-on Time-Max:

    650 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    6.73 mm

HI1-0201/883 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for HI1-0201/883 is -55°C to 125°C.
  • To ensure reliable operation in high-vibration environments, it is recommended to follow proper PCB design and layout guidelines, use a secure mounting method, and consider using a vibration-dampening material.
  • The maximum allowable power dissipation for HI1-0201/883 is 1.5W. It is essential to ensure that the device does not exceed this limit to prevent overheating and damage.
  • Yes, HI1-0201/883 is designed to be radiation-hardened and can be used in space and other high-radiation environments. However, it is essential to follow the recommended radiation-hardening guidelines and testing procedures.
  • To troubleshoot issues with HI1-0201/883, start by reviewing the datasheet and application notes, checking the power supply and input signals, and using debugging tools such as oscilloscopes and logic analyzers.

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HI1-0201/883 Overview

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