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HI1-0549-2 - Renesas Electronics

Description: The HI-546, HI-547, HI-548 and HI-549 are analog multiplexers with active overvoltage protection and guaranteed rON matching. Analog input levels may greatly exceed either power supply without damaging the device or disturbing the signal path of other channels. Active protection circuitry assures that signal fidelity is maintained even under fault conditions that would destroy other multiplexers. Analog inputs can withstand constant 70VP-P levels with ±15V supplies. Digital inputs will also sustain continuo

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HI1-0549-2 - Renesas Electronics PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - F16.3-1
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HI1-0549-2 Details

  • Manufacturer Part Number:

    HI1-0549-2

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CERDIP

  • Package Description:

    DIP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    F16.3

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Additional Feature:

    OVERVOLTAGE PROTECTION

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    R-CDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.3 mm

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    68 dB

  • On-state Resistance Match-Nom:

    105 Ω

  • On-state Resistance-Max (Ron):

    1500 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

HI1-0549-2 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the HI1-0549-2, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance. It's recommended to follow this guide to minimize thermal resistance and ensure reliable operation.
  • The HI1-0549-2 is capable of delivering high currents, which requires careful consideration of PCB design, component selection, and thermal management. Engineers should ensure that the PCB traces, vias, and components can handle the high current output, and that adequate heat sinking and thermal management are implemented to prevent overheating.
  • The input capacitors for the HI1-0549-2 should be selected based on the specific application requirements, including voltage rating, capacitance value, and ESR. Renesas recommends using low-ESR capacitors with a voltage rating of at least 2x the input voltage, and a capacitance value that meets the required ripple current and voltage regulation requirements.
  • To ensure EMC with the HI1-0549-2, engineers should follow Renesas' guidelines for PCB layout, component selection, and shielding. This includes using a solid ground plane, minimizing loop areas, and using shielded cables and connectors. Additionally, engineers should ensure that the system meets the relevant EMC standards and regulations for their specific application.
  • The HI1-0549-2 has a thermal derating curve that specifies the maximum allowed junction temperature and power dissipation at different ambient temperatures. Engineers should ensure that the system design takes into account these thermal derating considerations to prevent overheating and ensure reliable operation.

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HI1-0549-2 Overview

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