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HI3-0201-5Z - Renesas Electronics

Description: HI-200/HI-201 (dual/quad) are monolithic devices comprising independently selectable SPST switches which feature fast switching speeds (HI-200 240ns, and HI-201 185ns) combined with low power dissipation (15mW at 25°C). Each switch provides low ON resistance operation for input signal voltage up to the supply rails and for signal current up to 80mA. Rugged DI construction eliminates latch-up and substrate SCR failure modes. All devices provide break-before-make switching and are TTL and CMOS compatible for

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PCB Footprints
HI3-0201-5Z - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - E16.3 (JEDEC MS-001-BB ISSUE D) 16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
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3D Models
HI3-0201-5Z - Renesas Electronics  - 3D model - Dual-In-Line Packages - E16.3 (JEDEC MS-001-BB ISSUE D) 16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
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HI3-0201-5Z Details

  • Manufacturer Part Number:

    HI3-0201-5Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PDIP

  • Package Description:

    DIP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    E16.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e3

  • Length:

    19 mm

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NC

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    80 dB

  • On-state Resistance-Max (Ron):

    80 Ω

  • Operating Temperature-Max:

    75 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Seated Height-Max:

    3.94 mm

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.5 mm

  • Terminal Position:

    DUAL

  • Width:

    6.6 mm

HI3-0201-5Z Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for HI3-0201-5Z is -40°C to 125°C.
  • To ensure reliable communication, ensure that the clock frequency is within the specified range, use a stable clock source, and implement proper signal termination and routing on the PCB.
  • The HI3-0201-5Z supports a maximum data transfer rate of 100 Mbps.
  • Implement error detection and correction mechanisms, such as checksums and retries, to handle errors and ensure reliable data transfer.
  • The power consumption of HI3-0201-5Z is typically around 100 μA in active mode and 10 μA in standby mode.

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HI3-0201-5Z Overview

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