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HI5660/6IAZ - Renesas Electronics

Description: The HI5660 is an 8-bit, 125MSPS, High-Speed, low power, D/A converter which is implemented in an advanced CMOS process. Operating from a single +3V to +5V supply, the converter provides 20mA of full scale output current and includes edge-triggered CMOS input data latches. Low glitch energy and excellent frequency domain performance are achieved using a segmented current source architecture. For an equivalent performance dual version, see the HI5628. This device complements the HI5X60 family of High-Speed co

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HI5660/6IAZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M28.173 28 Lead Thin Shrink Small Outline Package (TSSOP)
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HI5660/6IAZ - Renesas Electronics  - 3D model - Small Outline Packages - M28.173 28 Lead Thin Shrink Small Outline Package (TSSOP)
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HI5660/6IAZ Details

  • Manufacturer Part Number:

    HI5660/6IAZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    M28.173

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-24

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog Output Voltage-Max:

    1.25 V

  • Analog Output Voltage-Min:

    -0.3 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    PARALLEL, 8 BITS

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Linearity Error-Max (EL):

    0.1953%

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Settling Time-Nom (tstl):

    0.015 µs

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

HI5660/6IAZ Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the HI5660/6IAZ is -40°C to 125°C, with a junction temperature (Tj) of up to 150°C.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking, using thermal interface materials, and minimizing thermal resistance.
  • The maximum allowed power dissipation for the HI5660/6IAZ is 1.5 W, with a maximum junction temperature (Tj) of 150°C. Exceeding this limit can lead to device failure or reduced lifespan.
  • To handle ESD protection for the HI5660/6IAZ, it's recommended to follow proper ESD handling procedures, including using ESD-safe equipment, wearing ESD-protective clothing, and implementing ESD protection circuits in the design.
  • The recommended PCB layout and routing strategy for the HI5660/6IAZ involves following proper layout guidelines, including minimizing signal trace lengths, using wide power traces, and avoiding signal routing under the device.

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HI5660/6IAZ Overview

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