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HI9P0547-9Z96 - Renesas Electronics

Description: The HI-546, HI-547, HI-548 and HI-549 are analog multiplexers with active overvoltage protection and guaranteed rON matching. Analog input levels may greatly exceed either power supply without damaging the device or disturbing the signal path of other channels. Active protection circuitry assures that signal fidelity is maintained even under fault conditions that would destroy other multiplexers. Analog inputs can withstand constant 70VP-P levels with ±15V supplies. Digital inputs will also sustain continuo

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HI9P0547-9Z96 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M28.3
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HI9P0547-9Z96 - Renesas Electronics  - 3D model - Small Outline Packages - M28.3
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HI9P0547-9Z96 Details

  • Manufacturer Part Number:

    HI9P0547-9Z96

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    M28.3

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Max (Vsup):

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Off-state Isolation-Nom:

    68 dB

  • On-state Resistance Match-Nom:

    126 Ω

  • On-state Resistance-Max (Ron):

    2000 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Signal Current-Max:

    0.02 A

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    1000 ns

  • Switch-on Time-Max:

    1000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

HI9P0547-9Z96 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the HI9P0547-9Z96, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance. Contact Renesas support for the layout guide.
  • The HI9P0547-9Z96 has an internal overcurrent protection feature, but it's recommended to implement an external overcurrent protection circuit to ensure reliable operation. A sense resistor and a comparator can be used to detect overcurrent conditions and trigger a shutdown or warning signal.
  • The recommended input capacitor value is 10uF to 22uF, with an X7R or X5R dielectric type. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • To ensure EMC compliance, follow Renesas' guidelines for PCB layout, component selection, and shielding. Additionally, consider using a metal shield or a shielded enclosure to reduce electromagnetic radiation. Conduct EMC testing to validate compliance with relevant standards.
  • The maximum operating temperature range for the HI9P0547-9Z96 is -40°C to +125°C. However, the device's performance and reliability may degrade at temperatures above 85°C. Ensure proper thermal management and heat sinking to maintain optimal operation.

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HI9P0547-9Z96 Overview

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