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HI9P5051-9Z - Renesas Electronics

Description: This family of CMOS analog switches offers low resistance switching performance for analog voltages up to the supply rails and for signal currents up to 80mA. ON resistance is low and stays reasonably constant over the full range of operating signal voltage and current. rON remains exceptionally constant for input voltages between +5V and -5V and currents up to 50mA. Switch impedance also changes very little over temperature, particularly between 0°C and 75°C. rON is nominally 25Ω for HI-5049 and HI-5051 an

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HI9P5051-9Z - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M6.15
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HI9P5051-9Z - Renesas Electronics  - 3D model - Small Outline Packages - M6.15
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HI9P5051-9Z Details

  • Manufacturer Part Number:

    HI9P5051-9Z

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    80 dB

  • On-state Resistance Match-Nom:

    1 Ω

  • On-state Resistance-Max (Ron):

    50 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Signal Current-Max:

    0.03 A

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

HI9P5051-9Z Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the PCB design.
  • A 10uF ceramic capacitor with X7R or X5R dielectric should be placed as close as possible to the device's power pins. Additional 1uF and 0.1uF capacitors can be added in parallel to filter out high-frequency noise.
  • Use a logic analyzer or oscilloscope to capture the I2C bus signals and verify that the clock and data lines are within the specified voltage and timing limits. Check for bus contention, clock stretching, and acknowledge errors.
  • Operating the device at the maximum junction temperature (150°C) can reduce its lifespan and increase the risk of thermal runaway. Ensure that the device is operated within the recommended temperature range (typically -40°C to 125°C) for reliable operation.

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HI9P5051-9Z Overview

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Part Image HI9P5051-9Z Intersil Corporation

SPDT, 2 Func, 1 Channel, CMOS, PDSO16