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HIP2103FRTAAZ-T - Renesas Electronics

Description: The HIP2103 is a half-bridge driver designed for applications using DC motors, 3-phase brushless DC motors, or other similar loads. The two inputs (HI and LI) independently control the high-side driver (HO) and the low-side driver (LO). HI and LI can be configured to enable/disable the device, which lowers the number of connections to a microcontroller and the cost. The low IDD bias current in the Sleep Mode prevents battery drain when the device is not in use, which eliminates the need for an external swit

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HIP2103FRTAAZ-T - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L8.3x3A
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HIP2103FRTAAZ-T - Renesas Electronics  - 3D model - Small Outline No-lead - L8.3x3A
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HIP2103FRTAAZ-T Details

  • Manufacturer Part Number:

    HIP2103FRTAAZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TDFN

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    L8.3X3A

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    1 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    1.04 mA

  • Supply Voltage-Max:

    14 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    60 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.046 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3 mm

HIP2103FRTAAZ-T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The HIP2103FRTAAZ-T has an exposed thermal pad, so a thermal relief pattern on the PCB is necessary to ensure good thermal conductivity.
  • Ensure that the device is properly heatsinked, and the thermal pad is connected to a solid ground plane. Also, follow the recommended operating conditions and derating guidelines in the datasheet.
  • The maximum allowed voltage on the VIN pin is 36V, but it's recommended to keep it below 30V to ensure reliable operation and minimize the risk of damage.
  • Yes, but ensure that the device is properly heatsinked and the thermal design is adequate. The device can handle high currents, but excessive heat can reduce its lifespan.
  • Check the input voltage, output voltage, and current. Verify that the device is properly heatsinked and that the thermal pad is connected to a solid ground plane. Consult the datasheet and application notes for troubleshooting guidelines.

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HIP2103FRTAAZ-T Overview

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Part Image HIP2103FRTAAZ-T7 Renesas Electronics Corporation

Half Bridge Based MOSFET Driver, 2A, PDSO8