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HIP2103FRTAAZ - Renesas Electronics

Description: The HIP2103 is a half-bridge driver designed for applications using DC motors, 3-phase brushless DC motors, or other similar loads. The two inputs (HI and LI) independently control the high-side driver (HO) and the low-side driver (LO). HI and LI can be configured to enable/disable the device, which lowers the number of connections to a microcontroller and the cost. The low IDD bias current in the Sleep Mode prevents battery drain when the device is not in use, which eliminates the need for an external swit

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HIP2103FRTAAZ - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - L8.3x3A
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HIP2103FRTAAZ - Renesas Electronics  - 3D model - Small Outline No-lead - L8.3x3A
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HIP2103FRTAAZ Details

  • Manufacturer Part Number:

    HIP2103FRTAAZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TDFN

  • Package Description:

    TDFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    L8.3X3A

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-27

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    1 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    1.04 mA

  • Supply Voltage-Max:

    14 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    60 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.046 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3 mm

HIP2103FRTAAZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The HIP2103FRTAAZ should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer between the device and heat sink.
  • The critical timing parameters include the input rise and fall times, output rise and fall times, and the propagation delay. These parameters are critical for ensuring reliable operation and should be carefully considered during design.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Also, follow proper PCB design and layout practices to minimize ESD susceptibility.
  • The recommended termination scheme depends on the specific application. For high-speed signals, use a series termination resistor (Rs) and a parallel termination capacitor (Cp) to match the transmission line impedance. For low-speed signals, a simple pull-up or pull-down resistor may be sufficient.

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