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HIP2210FRTZ-T7A - Renesas Electronics

Description: The HIP2210 is a 100V, 3A source, 4A sink high-frequency half-bridge NMOS FET driver. The HIP2210 features a tri-level PWM input with programmable dead time. Its wide operating supply range of 6V to 18V and integrated high-side bootstrap diode supports driving the high-side and low-side NMOS in 100V half-bridge applications.This driver features strong 3A source, 4A sink drivers with very fast 15ns typical propagation delay and 2ns typical delay matching, making it optimal for high-frequency switching applic

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HIP2210FRTZ-T7A - Renesas Electronics PCB footprint - Small Outline No-lead - Small Outline No-lead - 10 Ld 4x4 DFN
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HIP2210FRTZ-T7A - Renesas Electronics  - 3D model - Small Outline No-lead - 10 Ld 4x4 DFN
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HIP2210FRTZ-T7A Details

  • Manufacturer Part Number:

    HIP2210FRTZ-T7A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TDFN

  • Pin Count:

    10

  • Manufacturer Package Code:

    L10.4X4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2020-06-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC10,.16,32

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.75 mm

  • Supply Current-Max:

    1.69 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    115 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    4 mm

HIP2210FRTZ-T7A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the IC is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the junction temperature (TJ) and adjust the system design accordingly.
  • Keep the switching node (SW) and output voltage (VOUT) traces as short as possible, and away from sensitive analog signals. Use a solid ground plane, and consider adding a shield or screen to reduce radiated emissions.
  • Use the provided compensation network values as a starting point, and then adjust the components based on the specific application requirements and load conditions. Ensure that the loop gain and phase margin are adequate for stable operation.
  • Choose capacitors with low ESR, high ripple current rating, and suitable voltage ratings. Ensure that the capacitors are placed close to the IC and connected with short, wide traces to minimize parasitic inductance.

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HIP2210FRTZ-T7A Overview

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