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HIP4086AABZT - Renesas Electronics

Description: The HIP4086 and HIP4086A (referred to as the HIP4086/A) are 3-phase N-channel MOSFET drivers. Both parts are specifically targeted for PWM motor control. These drivers have flexible input protocol for driving every possible switch combination. The user can even override the shoot-through protection for switched reluctance applications. The HIP4086/A have a wide range of programmable dead times (0. 5μs to 4. 5μs) which makes them very suitable for the low frequencies (up to 100kHz) typically used for motor d

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HIP4086AABZT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 24 Ld SOIC (RoHS Compliant)
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HIP4086AABZT - Renesas Electronics  - 3D model - Small Outline Packages - 24 Ld SOIC (RoHS Compliant)
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HIP4086AABZT Details

  • Manufacturer Part Number:

    HIP4086AABZT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICW

  • Package Description:

    SOP, SOP24,.4

  • Pin Count:

    24

  • Manufacturer Package Code:

    M24.3

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-11-01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    GATED

  • Interface IC Type:

    HALF BRIDGE BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    15.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    5.1 mA

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    7 V

  • Supply Voltage-Nom:

    12 V

  • Supply Voltage1-Max:

    95 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.135 µs

  • Turn-on Time:

    0.158 µs

  • Width:

    7.5 mm

HIP4086AABZT Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the HIP4086AABZT near the edge of the board, using a solid ground plane, and minimizing the distance between the device and the heat sink. Additionally, using thermal vias and a thermal pad can help to dissipate heat more efficiently.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, using a heat sink, ensuring good airflow, and minimizing power dissipation can help to reduce the device temperature.
  • The critical components that affect the HIP4086AABZT's performance include the input capacitors, output inductors, and output capacitors. These components should be selected based on the recommended values and characteristics specified in the datasheet to ensure optimal performance.
  • To troubleshoot common issues such as overvoltage, undervoltage, and overcurrent protection, it is essential to follow the recommended troubleshooting procedure outlined in the datasheet. This includes checking the input voltage, output voltage, and current sense resistors, as well as verifying the proper operation of the protection circuits.
  • The recommended design considerations for EMI and noise reduction include using a shielded layout, minimizing loop areas, and using bypass capacitors to filter out high-frequency noise. Additionally, using a common-mode choke and a differential-mode filter can help to reduce EMI emissions.

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HIP4086AABZT Overview

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