The recommended land pattern for the HMC0402JT30M0 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
Handle the HMC0402JT30M0 by the edges or the body, avoiding touching the terminations or the component body to prevent damage from electrostatic discharge (ESD).
The maximum reflow temperature for the HMC0402JT30M0 is 260°C, with a peak temperature of 240°C for a maximum of 20 seconds.
Yes, the HMC0402JT30M0 is designed to withstand high-vibration environments, with a vibration frequency range of 10-2000 Hz and an acceleration of 20 G.
Store the HMC0402JT30M0 in a dry, cool place, away from direct sunlight and moisture, with a relative humidity of 60% or less, and a temperature range of -10°C to 30°C.
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HMC0402JT30M0 Overview
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