HMC0603JT50M0 footprint, schematic symbol and 3D model by Stackpole Electronics, Inc.

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HMC0603JT50M0 Details

The recommended land pattern for the HMC0603JT50M0 is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
The HMC0603JT50M0 is rated for operation up to 150°C, but it's recommended to derate the power rating at higher temperatures. Consult the datasheet for specific derating information.
Handle the HMC0603JT50M0 by the edges to prevent damage to the resistive element. Avoid touching the component's surface, as oils from human skin can affect solderability.
The HMC0603JT50M0 has an MSL rating of 1, which means it can withstand normal humidity levels without special handling or storage requirements.
The HMC0603JT50M0 is designed to withstand normal vibration levels, but it's recommended to consult the datasheet and perform additional testing for extreme vibration environments.

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