HMC0805JT100M footprint, schematic symbol and 3D model by Stackpole Electronics, Inc.

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HMC0805JT100M Details

The recommended land pattern for the HMC0805JT100M is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
Handle the HMC0805JT100M by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or floors to prevent electrostatic discharge (ESD) damage.
The maximum storage temperature for the HMC0805JT100M is 40°C (104°F) for a maximum of 12 months.
Yes, the HMC0805JT100M is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure proper mounting and soldering.
Use a soldering iron with a temperature of 250°C (482°F) to 270°C (518°F) and a solder with a melting point of 180°C (356°F) to 220°C (428°F). Apply a small amount of solder to the termination and use a soldering technique that minimizes the risk of overheating.

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