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HMC174MS8 - Analog Devices

Description: RF Switch ICs GaAs MMIC T/R SMT Switch DC - 3 GHz

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HMC174MS8 - Analog Devices - PCB symbol
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PCB Footprints
HMC174MS8 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - HMC189AMS8ETR
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3D Models
HMC174MS8 - Analog Devices - 3D model - Small Outline Packages - HMC189AMS8ETR
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HMC174MS8 Details

  • Manufacturer Part Number:

    HMC174MS8

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    HRH-10-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • 1dB Compression Point:

    36 dBm

  • Additional Feature:

    CMOS/TTL COMPATIBLE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    36 dBm

  • Insertion Loss-Max:

    1.8 dB

  • Isolation-Min:

    15 dB

  • JESD-609 Code:

    e0

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • On Time-Nom:

    0.024 µs

  • Operating Frequency-Max:

    3000 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP8,.19

  • Port Termination:

    REFLECTIVE

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    SPDT

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • VSWR-Max:

    1.12

HMC174MS8 Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep the device away from heat sources. A heat sink or thermal pad can be used to improve thermal management.
  • Use a combination of simulation tools and empirical methods to optimize the biasing and matching networks. Consider using a 50-ohm system and ensure the input and output impedances are matched to minimize reflections.
  • Operate the device within the recommended temperature range (-40°C to 85°C), avoid exceeding the maximum ratings, and ensure proper power sequencing to prevent damage.
  • Use a combination of simulation tools, oscilloscopes, and spectrum analyzers to identify the root cause. Check for proper biasing, matching, and decoupling, and ensure the device is operated within its recommended specifications.
  • Handle the device with ESD-protective equipment, avoid touching the pins, and use anti-static packaging and storage. Follow proper ESD handling procedures to prevent damage.

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HMC174MS8 Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like HMC17, or try a keyword search, such as RF/Microwave Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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HMC174MS8 Alternates

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Part Image HMC174MS8 Hittite Microwave Corp

Diversity Switch, 0MHz Min, 3000MHz Max, 1 Func, 1.8dB Insertion Loss-Max, GAAS