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HMC241ATCPZ-EP-R7 - Analog Devices

Description: RF Switch ICs EP GaAs MMIC SP4T

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HMC241ATCPZ-EP-R7 - Analog Devices - PCB symbol
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PCB Footprints
HMC241ATCPZ-EP-R7 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - (CP-16-51)
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3D Models
HMC241ATCPZ-EP-R7 - Analog Devices - 3D model - Quad Flat No-Lead - (CP-16-51)
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HMC241ATCPZ-EP-R7 Details

  • Manufacturer Part Number:

    HMC241ATCPZ-EP-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MO-220VEED-4, 16 PIN

  • Pin Count:

    16

  • Manufacturer Package Code:

    CP-16-51

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • 1dB Compression Point:

    24 dBm

  • Additional Feature:

    HIGH ISOLATION

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    17.48 dBm

  • Insertion Loss-Max:

    1.5 dB

  • Isolation-Min:

    25 dB

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • On Time-Nom:

    0.1 µs

  • Operating Frequency-Max:

    4000 MHz

  • Operating Frequency-Min:

    100 MHz

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Port Termination:

    ABSORPTIVE

  • Power Supplies:

    3/5 V

  • RF/Microwave Device Type:

    DIVERSITY SWITCH

  • Supply Current-Max:

    5 mA

  • Surface Mount:

    YES

  • Technology:

    GAAS

HMC241ATCPZ-EP-R7 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance can be found in the application note AN-1369 from Analog Devices, which provides guidelines for designing a PCB layout for the HMC241A. It is essential to follow these guidelines to ensure optimal performance, especially for high-frequency applications.
  • The HMC241ATCPZ-EP-R7 has a maximum junction temperature of 150°C. To handle thermal management, it is recommended to use a heat sink or a thermal pad to dissipate heat. Additionally, ensure good airflow around the device and avoid blocking the airflow with other components or obstacles.
  • The recommended soldering process for the HMC241ATCPZ-EP-R7 is a reflow soldering process with a peak temperature of 260°C. It is essential to follow the soldering profile recommended by Analog Devices to avoid damaging the device.
  • Common issues with the HMC241ATCPZ-EP-R7 include poor signal quality, incorrect biasing, and thermal issues. To troubleshoot these issues, check the PCB layout, ensure proper biasing, and verify that the device is operating within its recommended operating conditions. Additionally, consult the application notes and datasheet for troubleshooting guidelines.
  • The recommended storage and handling procedure for the HMC241ATCPZ-EP-R7 is to store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the package, avoiding touching the pins or die, and use an anti-static wrist strap or mat to prevent electrostatic discharge.

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HMC241ATCPZ-EP-R7 Overview

Use the download button to access the HMC241ATCPZ-EP-R7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like HMC24, or try a keyword search, such as RF/Microwave Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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