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HMC245QS16E - Analog Devices

Description: Analog Devices Hittite HMC245QS16E, RF Switch Circuit 3.5GHz Single SP3T 26dB Isolation CMOS/TTL Maximum of 5 V dc

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HMC245QS16E - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 Lead QSOP SMT
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HMC245QS16E - Analog Devices  - 3D model - Small Outline Packages - 16 Lead QSOP SMT
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HMC245QS16E Details

  • Manufacturer Part Number:

    HMC245QS16E

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SMT, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    HRQ-16-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • 1dB Compression Point:

    26 dBm

  • Additional Feature:

    CMOS/TTL COMPATIBLE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    26.99 dBm

  • Insertion Loss-Max:

    1 dB

  • Isolation-Min:

    26 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • On Time-Nom:

    0.15 µs

  • Operating Frequency-Max:

    3500 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SSOP16,.25

  • Port Termination:

    ABSORPTIVE

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    SP3T

  • Supply Current-Max:

    6 mA

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • Terminal Finish:

    Matte Tin (Sn)

  • VSWR-Max:

    1.22

HMC245QS16E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure good thermal conductivity and minimal thermal resistance to maintain junction temperature below 125°C.
  • Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider using a pi-network or a T-network topology, and adjust component values to achieve optimal impedance matching.
  • Operate the device within the recommended operating conditions: Vcc = 5V ± 10%, temperature range = -40°C to 85°C, and input power ≤ 10 dBm. Ensure proper heat sinking and avoid exceeding the maximum junction temperature.
  • Use a combination of simulation tools, oscilloscopes, and spectrum analyzers to troubleshoot issues. Check for proper PCB layout, component values, and soldering quality. Consult the datasheet and application notes for guidance on troubleshooting common issues.
  • Handle the device with ESD-protective equipment and follow proper handling procedures to prevent damage. Ensure the device is properly grounded and use ESD-protective packaging during storage and transportation.

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HMC245QS16E Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image HMC245QS16ETR Analog Devices Inc

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