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HMC252QS24E - Analog Devices

Description: ANALOG DEVICES - HMC252QS24E - RF Switch IC, SP6T, Non-Reflective, DC to 3 GHz, 3 V to 5 V, QSOP-24

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HMC252QS24E - Analog Devices - PCB symbol
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HMC252QS24E - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - HMC253AQS24E-1
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HMC252QS24E - Analog Devices - 3D model - Small Outline Packages - HMC253AQS24E-1
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HMC252QS24E Details

  • Manufacturer Part Number:

    HMC252QS24E

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    HRQ-24-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • 1dB Compression Point:

    24 dBm

  • Additional Feature:

    CMOS/TTL COMPATIBLE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    26.02 dBm

  • Insertion Loss-Max:

    1.8 dB

  • Isolation-Min:

    26 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • On Time-Nom:

    0.12 µs

  • Operating Frequency-Max:

    3000 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SSOP24,.24

  • Port Termination:

    ABSORPTIVE

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    SP6T

  • Supply Current-Max:

    8 mA

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • Terminal Finish:

    Matte Tin (Sn)

  • VSWR-Max:

    1.29

HMC252QS24E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and a heat sink if necessary.
  • Optimize the output power and efficiency by adjusting the input power, bias voltage, and load impedance. Use the device's built-in power detector to monitor output power and adjust accordingly.
  • Use a pi-network or a T-network for input and output matching. The exact values of the matching components depend on the specific application and frequency of operation.
  • Monitor the device's junction temperature, output power, and bias voltage to ensure they are within the recommended operating ranges. Use thermal management techniques and adjust the input power and bias voltage as needed.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. The device has built-in ESD protection, but it is not a substitute for proper handling and storage procedures.

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HMC252QS24E Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like HMC25, or try a keyword search, such as RF/Microwave Switches

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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