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HMC365S8GE - Analog Devices

Description: ANALOG DEVICES - HMC365S8GE - FREQUENCY DIVIDER, DIVIDE-BY-4, SOIC-8

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HMC365S8GE - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RD-8-3
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HMC365S8GE - Analog Devices  - 3D model - Small Outline Packages - RD-8-3
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HMC365S8GE Details

  • Manufacturer Part Number:

    HMC365S8GE

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMT-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RD-8-3

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Family:

    365

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    PRESCALER

  • Max Frequency@Nom-Sup:

    13000000000 Hz

  • Moisture Sensitivity Level:

    1

  • Number of Data/Clock Inputs:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

  • fmax-Min:

    13000 MHz

HMC365S8GE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and a heat sink if necessary.
  • Use a network analyzer to measure the input and output impedance of the device. Then, use a simulation tool like ADS or AWR to design and optimize the matching networks for maximum gain and efficiency.
  • Follow the recommended biasing and tuning procedures outlined in the datasheet and application notes. Use a variable voltage source and a spectrum analyzer to optimize the bias and tuning for maximum performance.
  • Monitor the device's voltage, current, and temperature to ensure they are within the recommended operating ranges. Use a thermal sensor and a voltage/current monitor to prevent overheating and overvoltage/overcurrent conditions.
  • Handle the device with an ESD wrist strap or mat, and ensure the PCB is designed with ESD protection in mind. Use a static-dissipative packaging material and follow proper handling and storage procedures to prevent ESD damage.

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HMC365S8GE Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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