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HMC365S8GTR - Analog Devices

Description: InGaP HBT Divide-by-4 SMT, DC - 13 GHz

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HMC365S8GTR - Analog Devices - PCB symbol
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HMC365S8GTR - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RD-8-3
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HMC365S8GTR - Analog Devices - 3D model - Small Outline Packages - RD-8-3
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HMC365S8GTR Details

  • Manufacturer Part Number:

    HMC365S8GTR

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMT-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    RD-8-3

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Family:

    365

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Logic IC Type:

    PRESCALER

  • Moisture Sensitivity Level:

    1

  • Number of Data/Clock Inputs:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    HBT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

  • fmax-Min:

    13000 MHz

HMC365S8GTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity and heat dissipation by using a heat sink and thermal interface material.
  • Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider using a load-pull analysis to optimize the output matching network.
  • Follow the recommended biasing and tuning procedures outlined in the datasheet and application notes. Ensure proper voltage and current settings, and use a calibrated signal generator and spectrum analyzer for tuning.
  • Use proper shielding, grounding, and decoupling techniques. Ensure good isolation between the HMC365S8GTR and other components, and use noise-reducing components such as ferrite beads and capacitors.
  • The HMC365S8GTR has a maximum junction temperature of 150°C and a maximum power dissipation of 10W. Ensure proper thermal management and heat dissipation to prevent overheating and damage.

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HMC365S8GTR Overview

Use the download button to access the HMC365S8GTR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like HMC36, or try a keyword search, such as Prescaler/Multivibrators

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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HMC365S8GTR Alternates

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Part Image HMC365S8G Analog Devices Inc

Prescaler, 365 Series, 1-Func, GAAS, PDSO8