HMC492LP3TR footprint, schematic symbol and 3D model by Analog Devices

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PCB Footprints

HMC492LP3TR - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - LFCSP_2026-1.1

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Datasheet Download Datasheet
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Part Number HMC492LP3TR
Manufacturer Analog Devices
Pin Count 17
Part Category Integrated Circuit
Package Category Quad Flat No-Lead
Footprint Name Quad Flat No-Lead - LFCSP_2026-1.1
Released Date Aug 28, 2026
Last Modified Date Aug 28, 2026 6:14 AM UTC
Pinout / Pin List Click Here (Member Only)

HMC492LP3TR Details

Manufacturer Part Number:
HMC492LP3TR
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Part Life Cycle Code:
Active
Package Description:
3 X 3 MM, PLASTIC, QFN-16
Pin Count:
16
Manufacturer Package Code:
HCP-16-3
Country Of Origin:
Philippines
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
8.5
Family:
492
JESD-30 Code:
S-PQCC-N16
JESD-609 Code:
e0
Length:
3 mm
Logic IC Type:
PRESCALER
Max Frequency@Nom-Sup:
18000000000 Hz
Moisture Sensitivity Level:
1
Number of Data/Clock Inputs:
1
Number of Functions:
1
Number of Terminals:
16
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Polarity:
COMPLEMENTARY
Package Body Material:
PLASTIC/EPOXY
Package Code:
VQCCN
Package Equivalence Code:
LCC16,.12SQ,20
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, VERY THIN PROFILE
Packing Method:
TR
Peak Reflow Temperature (Cel):
235
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Supply Voltage-Max (Vsup):
5.25 V
Supply Voltage-Min (Vsup):
4.75 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
GAAS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin/Lead (Sn85Pb15)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
20
Width:
3 mm
fmax-Min:
18000 MHz

HMC492LP3TR Frequently Asked Questions (FAQs)

For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, including keeping the signal traces short and away from noise sources, and using a solid ground plane. Additionally, a thermal pad on the bottom of the package should be connected to a heat sink or a thermal via to dissipate heat.
To ensure proper biasing and configuration, refer to the datasheet's application circuit and follow the recommended biasing and configuration guidelines. Additionally, consult with Analog Devices' application notes and evaluation boards for specific examples and guidance.
Potential sources of noise and interference include electromagnetic interference (EMI), radio-frequency interference (RFI), and thermal noise. To mitigate these, use proper shielding, grounding, and filtering techniques, and ensure that the device is operated within its recommended operating conditions.
To troubleshoot common issues, refer to the datasheet's troubleshooting section and application notes. Additionally, use simulation tools and modeling techniques to identify and isolate the root cause of the issue. Consult with Analog Devices' technical support team for further guidance.
The HMC492LP3TR has undergone various reliability and qualification tests, including temperature cycling, humidity testing, and electrical stress testing. These tests ensure the device meets its specified performance and lifespan requirements. Refer to the datasheet and Analog Devices' quality and reliability documentation for more information.

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HMC492LP3TR Overview

Use the download button to access the HMC492LP3TR schematic symbol and PCB footprint.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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