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HMC546MS8GE - Analog Devices

Description: RF Switch SPDT 200MHz to 2.2GHz 8dB Automotive 8-Pin MSOP EP T/R

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HMC546MS8GE - Analog Devices - PCB symbol
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HMC546MS8GE - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP]-
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HMC546MS8GE - Analog Devices - 3D model - Small Outline Packages - 8-Lead Mini Small Outline Package with Exposed Pad [MINI_SO_EP]-
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HMC546MS8GE Details

  • Manufacturer Part Number:

    HMC546MS8GE

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SMT-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    HRH-8-1

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    40 dBm

  • Insertion Loss-Max:

    1.5 dB

  • Isolation-Min:

    8 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • On Time-Nom:

    0.102 µs

  • Operating Frequency-Max:

    2200 MHz

  • Operating Frequency-Min:

    200 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP8,.19

  • Port Termination:

    ABSORPTIVE

  • Power Supplies:

    3 V

  • RF/Microwave Device Type:

    SPDT

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • Terminal Finish:

    Matte Tin (Sn)

  • VSWR-Max:

    1.12

HMC546MS8GE Frequently Asked Questions (FAQs)

  • A good PCB layout for the HMC546MS8GE involves keeping the signal paths short, using a solid ground plane, and minimizing the distance between the device and the antenna. It's also recommended to use a 4-layer PCB with a dedicated layer for the RF signal, a layer for the ground plane, and two layers for the power supply and control signals.
  • To ensure proper biasing, make sure to follow the recommended voltage and current settings outlined in the datasheet. The device requires a single 5V supply, and the recommended bias current is 100mA. Additionally, ensure that the voltage and current sources are clean and well-regulated to prevent noise and interference.
  • The HMC546MS8GE is designed to handle a maximum input power of +30dBm (1W). Exceeding this power limit can cause damage to the device or affect its performance. It's essential to ensure that the input power is within the recommended range to maintain the device's reliability and performance.
  • To troubleshoot common issues with the HMC546MS8GE, start by checking the PCB layout and ensuring that it meets the recommended guidelines. Verify that the device is properly biased and that the input power is within the recommended range. Check for any signs of damage or overheating, and ensure that the device is properly cooled. If the issue persists, consult the datasheet and application notes for troubleshooting guides or contact Analog Devices' technical support.
  • While the HMC546MS8GE is designed for 50Ω systems, it can be used in non-50Ω systems with proper impedance matching. To impedance match the device, use a π-network or a T-network topology, and calculate the required component values using the device's S-parameters. Consult the datasheet and application notes for more information on impedance matching.

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HMC546MS8GE Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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