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HMC674LP3E - Analog Devices

Description: Comparator Single 3.465V 16-Pin QFN EP T/R

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HMC674LP3E - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HMC674LP3E
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HMC674LP3E - Analog Devices  - 3D model - Quad Flat No-Lead - HMC674LP3E
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HMC674LP3E Details

  • Manufacturer Part Number:

    HMC674LP3E

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMT-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    HCP-16-1

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    COMPARATOR

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -3.3 V

  • Neg Supply Voltage-Nom (Vsup):

    -3 V

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    0.085 ns

  • Seated Height-Max:

    0.9 mm

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

HMC674LP3E Frequently Asked Questions (FAQs)

  • A good PCB layout for the HMC674LP3E involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended. Refer to the application note AN-1369 for more details.
  • To optimize power supply decoupling, use a combination of high-frequency and low-frequency capacitors (e.g., 100 nF and 10 μF) placed close to the device. The capacitors should be connected between the power supply pins and the ground plane. Additionally, use a low-ESR capacitor (e.g., 10 μF) on the output of the voltage regulator to filter out noise.
  • The HMC674LP3E is rated for operation from -40°C to +85°C. However, the device's performance may degrade at higher temperatures, and the output power may reduce. It's essential to ensure proper heat sinking and thermal management to maintain reliable operation.
  • While the HMC674LP3E is designed for 50 ohm systems, it can be used in non-50 ohm systems with some performance degradation. However, the device's output power and efficiency may be affected. It's recommended to consult with Analog Devices' application engineers to determine the feasibility of using the device in a non-50 ohm system.
  • To troubleshoot common issues with the HMC674LP3E, start by checking the power supply voltage, input signal level, and output load impedance. Ensure that the device is properly biased and that the input and output traces are properly terminated. Use a spectrum analyzer to check for oscillations or spurious signals. Consult the device's datasheet and application notes for more detailed troubleshooting guidelines.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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