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HMC686LP4ETR - Analog Devices

Description: IC MMIC MIXER BICMOS 24-QFN

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PCB Footprints
HMC686LP4ETR - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN 4x4
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HMC686LP4ETR - Analog Devices  - 3D model - Quad Flat No-Lead - QFN 4x4
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HMC686LP4ETR Details

  • Manufacturer Part Number:

    HMC686LP4ETR

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, PLASTIC, QFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    HCP-24-2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

HMC686LP4ETR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a heat sink and thermal interface material. Refer to the application note AN-1369 for more details.
  • Use the HMC686LP4ETR evaluation board as a reference and adjust the biasing and matching networks based on your specific frequency and impedance requirements. You can also use simulation tools like ADS or AWR to optimize the design.
  • Use a reflow soldering process with a peak temperature of 260°C. Ensure the device is handled and stored in an ESD-safe environment. Refer to the application note AN-1112 for more details on soldering and assembly.
  • Use a combination of visual inspection, signal integrity analysis, and debugging tools like oscilloscopes and spectrum analyzers. Check for proper power supply, biasing, and signal routing. Refer to the application note AN-1368 for troubleshooting guidelines.
  • The HMC686LP4ETR meets the standards for reliability and environmental testing as per the MIL-STD-883 and JEDEC JESD22-A114 standards. Refer to the datasheet and reliability report for more details.

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HMC686LP4ETR Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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