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HMC704LP4ETR - Analog Devices

Description: Integer-N/Fractional-N IC 8GHz 1 24-VFQFN Exposed Pad

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PCB Footprints
HMC704LP4ETR - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_2023
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3D Models
HMC704LP4ETR - Analog Devices  - 3D model - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_2023
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HMC704LP4ETR Details

  • Manufacturer Part Number:

    HMC704LP4ETR

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    4 X 4 MM, ROHS COMPLIANT, PLASTIC, SMT-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    HCP-24-2

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    PHASE LOCKED LOOP

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC24,.16SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    58 mA

  • Supply Voltage-Max (Vsup):

    3.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

HMC704LP4ETR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity and heat dissipation by using a heat sink and thermal interface material.
  • Use a combination of ceramic and electrolytic capacitors with different values (e.g., 100nF, 1uF, 10uF) to cover a wide frequency range. Place them close to the device and use a solid ground plane to minimize inductance.
  • Use a single-ended clock input with a 50Ω termination resistor. Ensure the clock signal has a low jitter and a stable frequency to minimize phase noise and spurs.
  • Adjust the input attenuation and gain settings according to the input signal level. Ensure the input signal is within the recommended range (typically -10 dBm to 10 dBm) and adjust the gain to optimize the dynamic range.
  • Use a shielded enclosure, keep sensitive signals away from the device, and use EMI filters or common-mode chokes on the power supply lines. Ensure good grounding and decoupling to minimize radiation and susceptibility.

Trust Checks

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Manufacturer Collaborated
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HMC704LP4ETR Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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