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HMC720LP3ETR - Analog Devices

Description: 13 Gbps Fast Rise Time 1:2 Fanout Buffer with Programmable Output Voltage

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HMC720LP3ETR - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HMC721LP3E.
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HMC720LP3ETR Details

  • Manufacturer Part Number:

    HMC720LP3ETR

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LCC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    HCP-16-3

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Family:

    ECL

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    90 mA

  • Prop. Delay@Nom-Sup:

    0.12 ns

  • Propagation Delay (tpd):

    0.12 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    -3.6 V

  • Supply Voltage-Min (Vsup):

    -3 V

  • Supply Voltage-Nom (Vsup):

    -3.3 V

  • Surface Mount:

    YES

  • Technology:

    ECL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

HMC720LP3ETR Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal management for the HMC720LP3ETR can be found in the 'PCB Layout and Thermal Management' section of the ADI's application note AN-1369. It provides guidelines for optimal performance, including component placement, thermal vias, and heat sink design.
  • To optimize power consumption, consider using the device's power-down mode, adjusting the clock frequency, and optimizing the voltage regulator module (VRM) design. Additionally, consult the 'Power Consumption' section of the datasheet and the 'Power Management' chapter of the ADI's application note AN-1369 for more information.
  • The recommended settings for the internal voltage regulators can be found in the 'Voltage Regulator Module (VRM)' section of the datasheet. Additionally, consult the 'VRM Configuration' chapter of the ADI's application note AN-1369 for more information on optimizing the VRM design for your specific application.
  • Consult the 'Troubleshooting' chapter of the ADI's application note AN-1369, which provides guidance on troubleshooting common issues with the HMC720LP3ETR. Additionally, refer to the 'PLL and Clocking' section of the datasheet for more information on PLL lock detection and clock jitter specifications.
  • The recommended ESD protection and handling procedures for the HMC720LP3ETR can be found in the 'ESD Protection' section of the datasheet. Additionally, consult the 'Handling and Storage' chapter of the ADI's application note AN-1369 for more information on proper handling and storage procedures to prevent ESD damage.

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HMC720LP3ETR Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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