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HMC814LC3B - Analog Devices

Description: RF Amplifier x2 Active mult SMT, 13 - 24.6 GHz Fout

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PCB Footprints
HMC814LC3B - Analog Devices PCB footprint - Other - Other - HMC573LC3B-2
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3D Models
HMC814LC3B - Analog Devices  - 3D model - Other - HMC573LC3B-2
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HMC814LC3B Details

  • Manufacturer Part Number:

    HMC814LC3B

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, LEADLESS, SMT, 12 PIN

  • Pin Count:

    12

  • Manufacturer Package Code:

    E-12-1

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    10 dBm

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    12

  • Operating Frequency-Max:

    12300 MHz

  • Operating Frequency-Min:

    6500 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • RF/Microwave Device Type:

    FREQUENCY DOUBLER

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold/Nickel (Au/Ni)

HMC814LC3B Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity and heat dissipation by using a heat sink and thermal interface material.
  • Use a combination of simulation tools and empirical methods to optimize the input and output matching networks. Consider using a load-pull analysis to determine the optimal impedance matching.
  • Operate the device within the recommended temperature range (-40°C to 85°C) and ensure a stable power supply voltage. Avoid exceeding the maximum ratings for voltage, current, and power dissipation.
  • Use a combination of simulation tools, oscilloscopes, and spectrum analyzers to identify and isolate issues. Check for proper PCB layout, component selection, and soldering quality.
  • Handle the device with ESD-protective equipment and follow proper handling procedures to prevent damage. Ensure the device is properly grounded and use ESD-protective packaging during storage and shipping.

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HMC814LC3B Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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