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HMC829LP6GE - Analog Devices

Description: Phase Locked Loops - PLL PLL + VCO 2700-4200MHz

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HMC829LP6GE - Analog Devices - PCB symbol
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PCB Footprints
HMC829LP6GE - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_2023-1
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3D Models
HMC829LP6GE - Analog Devices - 3D model - Quad Flat No-Lead - LFCSP:LEADFRM CHIP SCALE_2023-1
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HMC829LP6GE Details

  • Manufacturer Part Number:

    HMC829LP6GE

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMT-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    HCP-40-1

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    6 mm

HMC829LP6GE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a heat sink and thermal interface material. Refer to the application note AN-1369 for more details.
  • Optimize the output power and efficiency by adjusting the input power, bias voltage, and load impedance. Use the device's built-in power detector and adjust the bias voltage to achieve the desired output power. Refer to the application note AN-1369 for more details.
  • The recommended input and output matching networks can be found in the application note AN-1369. The input matching network should be designed to match the 50 ohm input impedance, and the output matching network should be designed to match the load impedance.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Use ESD-protective packaging and storage materials. Ensure that the device is properly grounded during handling and assembly.
  • The HMC829LP6GE has undergone various reliability and qualification tests, including temperature cycling, humidity testing, and mechanical stress testing. Refer to the device's reliability report for more details.

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HMC829LP6GE Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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