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HMC832ALP6GE - Analog Devices

Description: Phase Locked Loops - PLL WBand RF PLL VCO, 25-3000MHz 25 MHz to 3000 MHz Fractional-N PLL with Integrated VCO

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HMC832ALP6GE - Analog Devices - PCB symbol
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PCB Footprints
HMC832ALP6GE - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - . 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 6 mm × 6 mm Body, Very Thin Quad (HCP-40-1)
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3D Models
HMC832ALP6GE - Analog Devices - 3D model - Quad Flat No-Lead - . 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 6 mm × 6 mm Body, Very Thin Quad (HCP-40-1)
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HMC832ALP6GE Details

  • Manufacturer Part Number:

    HMC832ALP6GE

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LFCSP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    HCP-40-1

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • JESD-30 Code:

    S-XQCC-N40

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

HMC832ALP6GE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and a heat sink if necessary.
  • Use a high-quality voltage regulator, decouple the power supply with 10nF and 100nF capacitors, and ensure a low-jitter clock source. Also, optimize the PCB layout to minimize noise coupling.
  • Use 50Ω termination for the input and output ports, and ensure that the transmission lines are properly matched to minimize reflections and signal degradation.
  • Use the SPI interface to program the device's registers to configure the frequency band, modulation scheme, and other parameters. Refer to the datasheet and programming guide for details.
  • Power up the device in the following sequence: VCC, VDD, and then enable the clock. Power down in the reverse sequence. Ensure that the clock is disabled before powering down.

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HMC832ALP6GE Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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