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HMC837LP6CETR - Analog Devices

Description: Fractional-N PLL with Integrated VCO SMT, 1.025 - 4.6 GHz

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HMC837LP6CETR - Analog Devices - PCB symbol
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PCB Footprints
HMC837LP6CETR - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - H783
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HMC837LP6CETR - Analog Devices - 3D model - Quad Flat No-Lead - H783
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HMC837LP6CETR Details

  • Manufacturer Part Number:

    HMC837LP6CETR

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMT-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    HCP-40-1

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    PLL FREQUENCY SYNTHESIZER

  • JESD-30 Code:

    S-PQCC-N40

  • Length:

    6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    3.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    6 mm

HMC837LP6CETR Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal management for the HMC837LP6CETR can be found in the 'PCB Layout and Thermal Management' section of the application note AN-1369. It provides guidelines for minimizing thermal resistance, reducing electromagnetic interference, and optimizing signal integrity.
  • The power supply design should ensure a low noise, low impedance power source. A recommended power supply design is shown in the 'Power Supply Decoupling' section of the datasheet. Additionally, the application note AN-0973 provides more detailed information on power supply design and decoupling for high-frequency devices.
  • The recommended settings for the SPI interface can be found in the 'Serial Peripheral Interface (SPI)' section of the datasheet. The SPI interface operates in mode 0, with a clock frequency up to 50 MHz. The device requires a minimum of 16 clock cycles for each SPI transaction.
  • The HMC837LP6CETR requires calibration for optimal performance. The calibration procedure involves setting the internal voltage regulator, adjusting the PLL loop filter, and calibrating the output stage. The calibration procedure is described in the 'Calibration' section of the datasheet.
  • The thermal shutdown threshold is typically 150°C, and the thermal warning threshold is typically 120°C. These thresholds can be adjusted through the SPI interface. The thermal shutdown and warning thresholds are described in the 'Thermal Shutdown and Warning' section of the datasheet.

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HMC837LP6CETR Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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