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HMF212B7473KGHT - TAIYO YUDEN

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT 0805 100VDC 0.047uF 10% X7R AEC-Q200

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Symbol
HMF212B7473KGHT - TAIYO YUDEN - PCB symbol
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PCB Footprints
HMF212B7473KGHT - TAIYO YUDEN PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - 0805
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3D Models
HMF212B7473KGHT - TAIYO YUDEN - 3D model - Capacitor Chip Non-polarised - 0805
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HMF212B7473KGHT Details

  • Manufacturer Part Number:

    HMF212B7473KGHT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Capacitance:

    0.047 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    1.25 mm

  • Length:

    2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    100 V

  • Reference Standard:

    AEC-Q200

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Tan Delta:

    0.035

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Width:

    1.25 mm

HMF212B7473KGHT Frequently Asked Questions (FAQs)

  • The recommended land pattern for HMF212B7473KGHT is a rectangular pad with a size of 3.2mm x 1.6mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, it is recommended to use a peak temperature of 260°C and a dwell time of 30-60 seconds. The component should be placed on a flat surface and secured with a fixture or adhesive to prevent movement during the reflow process.
  • The maximum operating temperature range for HMF212B7473KGHT is -40°C to 125°C. However, the component's performance may degrade at temperatures above 85°C, and it is recommended to operate it within the -20°C to 70°C range for optimal performance.
  • Yes, HMF212B7473KGHT is designed to withstand high-vibration environments. However, it is recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent movement during vibration.
  • HMF212B7473KGHT components should be stored in a dry, cool place away from direct sunlight and moisture. The components should be stored in their original packaging or in a sealed bag with a desiccant to maintain a relative humidity of 20% or less.

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HMF212B7473KGHT Overview

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HMF212B7473KGHT Alternates

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Part Image CGA4J2X7R2A473K125AE TDK Corporation

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Part Image OP21B473K101LT Walsin Technology Corporation

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Part Image BC051C473KZB1SA1 Kyocera AVX Components

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For a full list of alternate parts for HMF212B7473KGHT, check out Findchips.com