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HMF316B7102KFHT - TAIYO YUDEN

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT 1206 100VDC 1000pF 10% X7R AEC-Q200

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HMF316B7102KFHT - TAIYO YUDEN - PCB symbol
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PCB Footprints
HMF316B7102KFHT - TAIYO YUDEN PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - HMF316B7102KFHT
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HMF316B7102KFHT - TAIYO YUDEN - 3D model - Capacitor Chip Non-polarised - HMF316B7102KFHT
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HMF316B7102KFHT Details

  • Manufacturer Part Number:

    HMF316B7102KFHT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Capacitance:

    0.001 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    1.15 mm

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    100 V

  • Reference Standard:

    AEC-Q200

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Tan Delta:

    0.025

  • Temperature Characteristics Code:

    X7R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Width:

    1.6 mm

HMF316B7102KFHT Frequently Asked Questions (FAQs)

  • The recommended land pattern for HMF316B7102KFHT is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.15mm.
  • To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB under the component, with a size of at least 2.5mm x 2.5mm. The thermal pad should be connected to a ground plane or a thermal via to dissipate heat efficiently.
  • The maximum operating temperature range for HMF316B7102KFHT is -40°C to +125°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range for an extended period.
  • Yes, HMF316B7102KFHT is designed to withstand high-vibration environments. However, it is recommended to follow proper mounting and soldering techniques to ensure the component's reliability and performance.
  • To ensure the reliability of HMF316B7102KFHT in a humid environment, it is recommended to apply a conformal coating to the PCB and component. Additionally, the component should be stored in a dry environment with a relative humidity of less than 60%.

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HMF316B7102KFHT Overview

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